DO NOT SCRAP IT! MODERATED NATIONAL EXCHANGE NEWSGROUP FOR SALVAGERS   >   Idaho   >   300×320 mm smd bga ic automatic reflow machine oven

300×320 mm smd bga ic automatic reflow machine oven


300×320 mm smd bga ic automatic reflow machine oven

Tech Support | RMA Service| About Us | Contact Us | Home
NEW SMD and BGA IC Small Automatic Smart Reflow Oven
We are a U.S. instrument/equipment supplier carrying a full line of high quality infrared BGA reworking and IRDA welding equipment. All our products are manufactured under the strict quality control guidelines established by ISO 9001: 2000 Standards. Their quality is insured by our return policy and full-coverage warranty! We do more than just sell you a product. We provide immediate support for any issues regarding your purchase. We are only a phone call away. If you have any questions, please feel free to call our toll free number below for assistance:
Callers outside of the USA please call ++ (***) 393 9488
* Extra big infrareo soldering max area as big as 11.8x12.6inch(300×320mm), Increase the usage scope of this machine consumedly, economical investment.
* Easy to use: Eight temperature parameter waves provided; compulsory heating and cool off function allowed;The whole soldering process is completed automatically
* Specially designed heating up and temperature maintainance: Output power reaches up to 1500W, Fast infrared radiation combined with thermostat fan, making the temperature control more accurate and even
* Visualization of the operation: Friendly human-machine interface
* Perfect function choice. Retro-weltering, drying, thermal insulation, amorphous, rapid cooling and other functions integrated in one machine. Can solder all forms of single- or double-sided PCB packaged in the form of CHIP, SOP, PLCC, QFP or BGA. Can be used for fixing products with gum, PCB thermal aging, PCB maitainance and other kinds of work. Widely applicable to various kinds of enterprises, companies, research institutions and small-quantity production needs.
* Effective Welding Size: 11.8 x 12.6 inch (300 × 320 mm)
* Product appearance Dimensions: 16.9 x 14.6 x 10.2 inch (43 x 37 x 26 cm) pumped
* Process cycle: 1 ~ 8 min
* Packing Size: 19.7 x 16.9 x 13.0 inch (50 x 43 x 33 cm)
* 1 welding table - main body
* 1 infrared heat lamp body
* 1 circuit board support (PCB support)
* 1 user's manual(compact disc)
* We accept money orders/cashier's checks, business/personal checks and bank wiring transfers
* For orders from any other countries, please email us for quote
* Please allow up to 10 business days for return to be processed.
* Contact us at M_lawson@dontscrapit.com
Copyright ? 2006-2007 ComeWithStyle. All Rights Reserved. All other trademarks are properties of their respective owners.
ComeWithStyle is not responsible for any typographical errors. Prices and specifications are subject to change without notice.
Temporary Email: M_lawson@dontscrapit.com (Meagan Lawson)




 300×320 mm smd bga ic automatic reflow machine oven