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K&s kulicke & soffa 1470 automatic wedge wire bonder


K&s kulicke & soffa 1470 automatic wedge wire bonder

K&S Kulicke & Soffa Industries Model 1470 Series B Automatic Wedge Bonder
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K&S Kulicke & Soffa Industries Model 1470 Series B Automatic Wedge Bonder
* Model Number: 1470 Series B
* With K&S Data Terminal, Model 1470-1000-0. With K&S Floppy Disk System, Model 4430. With K&S Unit 4322, 12 MSEC delay 1 amp, #4322-104-0. With Sanyo monitor, Model VM4509. With EC Permanent Magnet Servo Motor-Tach.
The K&S Kulicke & Soffa Model 1470 Automatic Wedge Bonder consists of a wire bonding machine, a separate 2-channel ultrasonic generator, a separate high-intensity light with fiber optics, and a separate CCTV monitor mounted on a sturdy base. A separate computer is an essential part of the system. The computer is mounted on four wheels, for ease of maintenance and setup, and is connected to the wire bonding machine with cables.
The wire bonding machine is equipped with a movable X-Y table in a metal base. The X-Y table carries a device mounted in a workholder in two directions as commanded by the operator or by the computer. The two directions are left and right (“X”) and forward and rearward (“Y”); therefore, the X-Y table can only move a device in a flat plane. The bond head on the machine moves in two directions (up and down, the “Z” direction), and in a full circle in a plane parallel to the X-Y movement. The 360-degree motion is known as (theta) motion and is abbreviated as “?”, the Greek symbol for “theta”. The bond head holds a wedge (the “tool”) and the wire which makes the bonds. The tool moves in the theta and Z directions. The value of these motions is apparent when it is understood that the X-Y table can move a point to be bonded on a device under the tool. The Z motion of the bond head allows the tool to make contact with the work, attaching the wire between the pads or fingers on a device. The theta motion of the bond head allows the wedge bonding tool to be aligned with the two bonding points before the first bond is made. The tool stays in alignment with both bond points until the second bond is completed. After the first bond, the tool lifts, the X-Y table moves the device in a straight line to place the second bond point under the tool. The motion of the X-Y table pulls bonding wire through the tool. Since the tool is always aligned with the two bonding points, the aluminum wire moves freely through a funnel in the rear of the tool without kinking or excessive drag.
The operator and the computer operate the K&S Kulicke & Soffa Model 1470 Automatic Wedge Bonder. The computer learns the positions of each bond in the proper sequence during the self teach mode. After teaching one device, the machine is ready to bond wires on identical following devices automatically, after the operator checks certain reference points on each following device.
Each K&S Kulicke & Soffa Model 1470 Automatic Wedge Bonder requires a workholder. The workholder is attached to the X-Y table. Moving the X-Y table moves the device. Devices are also moved (“indexed”) by certain mechanized workholders. A strip of devices can be indexed under the bonding head by automatic workholders. These workholders can take a strip of devices out of a magazine, index successive devices to be bonded under the bonding head, and move the fully-bonded strip into a storage magazine automatically.
Wire bonding is an essential part of the semiconductor production process. Aluminum wire wedge bonding is one highly satisfactory technique for achieving consistently superior interconnections while operating at high speeds with no heating requirement.
Aluminum wire wedge bonding utilizes three precisely controlled variables; compression force, ultrasonic vibration, and time.
The first of these variables, compression force, must be consistently repeatable from cycle to cycle, and is generally held at approximately 25 grams. Much greater force would result in “smashed”, deformed bonds; inadequate force would fail to produce bonds with satisfactory strength. Compression force can be adjusted by changing tension on a spring. This adjustment accommodates varying sizes of wires.
The second variable, the application of ultrasonic energy through the bonding head, is in the form of a 59.6 kHz signal which is locked on frequency and amplitude.
The third variable, “time”, is the pulse duration of ultrasonic energy. “Time” must be closely controlled but is adjustable for specific bonds within range of 10-300 msec.
* Primarily Designed For: Arrays, Hybrid Circuits
* Useful Table Travel: 3 5/8” (X) x 4” (Y)
* Maximum Number of Wires per Device: 800 to 2000
* Wire Diameter: 1 to 2 mils
* Recommended Wedge Tool: Micro-Swiss 436 60/40
* Computer Dimensions: 28” H x 18” W x 26” L
* Bonding Machine Dimensions: 32” H x 50” W x 39” L
* Bonding Machine Weight: 450 lbs.
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