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> Syntech lf lead free solder paste; sac 305 500GRAM jar
Syntech lf lead free solder paste; sac 305 500GRAM jar
Syntech lf lead free solder paste; sac 305 500GRAM jar
n Long stencil life and wide process window
n Excellent wetting compatibility on most board finishes
n Compatible with enclosed printing heads
AMTECH manufactures a low-oxide, spherical and
uniformly sized powder. SynTECH-LF is available in
the following alloys: Sn96.5/Ag3.0/Cu.5, Sn96.5/Ag3.5,
Sn99.3/Cu.7, Sn95/Sb5 and Sn95/Ag5 alloys.
The following packaging options are available
for stencil printing and dispensing applications:
250g and 500g jars; 250g and 700g cartridges;
>10 hrs. @ 30–45% RH & 22–25°C
Printing applications: 900 to 1,200Kcps +/-10%
Dispensing applications: 450Kcps +/-10%
Tested according to IPC-TM-650
The print definition of SynTECH-LF is ideal for fine pitch
applications. The stencil life of this no-clean product virtually
eliminates waste of solder paste. Consult the powder
distribution chart to determine your mesh size requirements.
The following are general guidelines for stencil printer
optimization with SynTECH-LF. Some adjustments may
be necessary based on your process requirements.
Squeegee Pressure: 0.2–0.7kg/inch of blade
Under Stencil Wipe: Once every 10–25 prints or as necessary
Automated stencil cleaning systems for both stencil and
misprinted boards. Manual cleaning using 99% isopropyl
Refrigerated storage at 42–47°F will prolong the solder paste
shelf life to no less than 6 months. Syringes & cartridges should
be stored vertically with the dispensing tip down. Solder paste
should be allowed to reach ambient temperature naturally, prior
to use (about 6-8 hours). NEVER FREEZE SOLDER PASTE.
J-STD-004 (IPC-TM-650) Test Results
Flux Designator IPC-TM-650 2.3.35 NA RELO
Copper Mirror IPC-TM-650 2.3.32 NA PASS
Silver Chromate IPC-TM-650 2.3.33 NA PASS
Bono Mirror Test <10% 1.56% PASS
SIR Test IPC-TM-650 2.6.3.3 4.93E+10 PASS
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